sadow thermal compound paste use coolers heat sink cpu chipset | Shop The World
From India
NewSadow
Sadow Thermal Compound Paste Use in Coolers Heat Sink for CPU and Chipsets (Grey, 30 g) (Pack of 5)
•Material : ISOL 6, Heat Sink Compound. Colour : Grey, Packing Type : Injection, Weight : Approx. 30 g
•Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently.
•The Heat Sink Paste is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards.
•Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
