More efficiency, the Mugen 6 series features a 45% increase in fin count at 154mm height, with 6 nickel-plated copper heat pipes integrated into an aluminum heatsink. This design enhances thermal conductivity with a denser fin array and improved soldering for superior heat dissipation. it's ideal choice for high TDP processor from Intel (e.g. 14900K, 14700K, 14600K) and AMD (e.g. 7950X3D, 7900X3D, 7800X3D, 7700)
Multi-platform support, the H.P.M.S. V is SCYTHE 5th Gen spring-loaded mounting system that provides a secure fit and optimal contact pressure on the CPU. Easy to install, H.P.M.S. V offers full support to Intel LGA1700, LGA1200, LGA115x, LGA 2066 and AMD AM5 & AM4 Platform.