ec buying amc1301 analog signal isolation module isolated curr | Shop The World
From USA
NewEC Buying
EC Buying AMC1301 Analog Signal Isolation Module Isolated Current Acquisition Module 200KHz Bandwidth DC-DC Converter 3 Channel 4 Layer FR4 PCB Board
ℹ
Products from the USA may come with an input voltage of 110V–120V, requiring a step-down transformer. Check the device wattage to select the correct power converter.
•Features :AMC1301 input voltage in the range of ±250 mv, current measurement will use shunt resistance. Low offset error and drift of 25°C ±150µV (Max), ±5µV/°C (Max). The AMC1301 has a fixed gain of 8.2. Extremely low gain error and drift of 0.5%(Max) at 25°C, ±50 ppm/°C(Max). Very low nonlinearity and drift is 0.075%(Max) at 2.4 ppm/°C. Has 3.3v high and low side operation.
•The input:The input of the AMC1301 is optimized for direct connection to shunt resistors or other low voltage level signal sources. The excellent performance of the device supports accurate current control resulting in system-level power saving and, especially in motor control applications, lower torque ripple. The AMC1301 is fully specified over the extended industrial temperature range of –40°C to +125°C
•Circuit: This circuit uses voltage divider and ±250mV differential input, differential output AMC1300B isolation amplifier for high voltage differential measurement. Because the AMC1300B is a low input impedance device, it is more suitable for current detection applications. The interaction between the input impedance of the isolation amplifier and the input voltage divider will cause the gain error.
•Application :AMC1301 is current sensing based on shunt resistance. Applications are motor control, green energy, high frequency inverter, uninterruptible power supply. The AMC130's isolated voltage sensing is used in high frequency inverters.
•Electrostatic Discharge Caution:The integrated circuit can be damaged by static electricity. It is recommended that all IC handles take appropriate precautions. Failure to follow proper operation and installation procedures can cause damage. Electrostatic damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more vulnerable to damage because very small parameter changes may cause the device to fail to meet its specifications.
From USA
