BGA Reballing Stencils, Rounded Rectangular Hole Prevent Half | Shop The World
From India
Newsoobu
BGA Reballing Stencils, Rounded Rectangular Hole Prevent Half Cut Process Breakage BGA Reballing Steel Stencil Set for Cell Phone
•NO TIN STICKING OR BROKEN CORNERS: Using half cut process, there are many IC groove on the main body of the stencil, which can effectively prevent small ICs from sticking to tin and protect small ICs from breaking corners
•FAST AND ACCURATE: The speed of tin planting is fast, the ball template will not change under high temperature, and bring accurate positioning
•APPLICABLE MODELS: Suitable for S7 series, NOTE8 series, A5 series, NOTE4 series, JS series and other models
•13PCS IN TOTAL: The package contain a total of 13pcs steel stencil, enough for you to replace and use, very convenient
•COMPACT AND PORTABLE: BGA reballing stencil come with compact appearance, portable, easy to use and long lasting
